We have disassembled several of these. They have about a 1 inch by 1 inch Heat sink and thermal pad that is purposefully dumping heat into the case away from the internals. The PCB is actually on rails suspended in the middle of the casing so it is using the entire of the exterior of the case top and bottom. so there’s no place heat buildup could cause problems. We run these pretty hard as well and have had no issues.
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